Welcome Message from the Chairpersons
On behalf of the steering and organizing committees, it is our great pleasure to welcome you to the twenty-third annual IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (IEEE CIVEMSA 2018), held in Ottawa, Canada, on June 12-13, 2018.
This conference is co-sponsored by the IEEE Computational Intelligence and IEEE Instrumentation and Measurement Societies. It focuses on all aspects of computational intelligence, virtual environments and human-computer interaction technologies for measurement systems and related applications. We believe that the organizing and steering committees have put together a very exciting and interesting program. This latter includes peer-reviewed papers that highlight standpoints on some latest recent advances to address some critical computational intelligence challenges for intelligent measurement, virtual reality systems, machine & deep learning for intelligent systems, and applications. In this twenty-third year of the conference, we have made a few changes to add to what was already previously a strong program. For one, we initiated opening this conference to external sponsors from academia, industry and organization entities, in addition to the two existing IEEE co-sponsors societies. Additionally, to acknowledge excellence and merit in a conference paper candidate, we also started an IEEE Best Paper Award, from the IEEE co-sponsors societies, based on paper novelty, clearness, ingenuity and groundbreaking research in the respective area.
We believe that the keynote speaker topic shelters a highly relevant set of materials that we trust will bring some conference participants to share viewpoints and thoughts on this topic. In particular, the two-day conference program aims to provide a forum for the attendees to carry out presentations, information exchanges, and extensive discussions on theory, methodology and application in the field of interest of the conference. This is as well as to foster networking, planning for future collaborations and new research projects that will further advance the use of computational intelligence and virtual environments in the instrumentation and measurement field and the related applications. We hope the conference will foster and discuss opportunities and challenges in using computational intelligence and virtual environments breakthroughs aiming to the advancement of instrument performance and measurement capabilities, and all related applications in a broad spectrum of areas. To promote interaction and discussion in the audience, sufficient time is allocated to presenters not only to introduce their achievements, but also to engage in extended discussions with the participants.
This year we have participants from more than twelve countries. Participants are welcome to benefit from the rich research work that will be presented and enjoy the hospitality and diversity of Ottawa. The town is the administrative heart of Canada and the University of Ottawa’s main campus is located in the core downtown area, just minutes from the Parliament Hill, numerous museums, the world-renowned Rideau Canal, UNESCO World Heritage Site, and the ByWard Market with its vibrant cultural life, a wide variety of boutiques, restaurants and accommodations. May and June offer the most beautiful weather conditions of the year, making it the ideal time for exploring the capital.
We hope you will find IEEE CIVEMSA 2018 a challenging and productive experience, celebrating the twenty second-year anniversary of this conference, since its inception in 1996 as “IEEE Workshop on Emerging Technologies for Instrumentation and Measurement”. We trust that you will also enjoy the location, the culture and the food: Ottawa will be an exciting experience!
We are looking forward to meeting everyone at the conference in June.
Rafik Goubran, Carleton University, Ottawa, Canada
Ana_Maria Cretu, Carleton University, Ottawa, Canada
Dalila B. Megherbi, University of Massachusetts, Lowell, USA
Technical Program Chairs
Pierre Payeur, University of Ottawa, Canada
Sebastian Zug, Otto von Guericke University, Germany
Angelo Genovese, Università degli Studi di Milano, Italy